Advantages of Low Temperature Co-fired Ceramics (LTCC)

Low Low Temperature Co-fired Ceramics (LTCC) is a ceramic material used in the production of electronic components. It is a multilayer structure consisting of alternating layers of conductive, insulating and resistive materials. The layers are made of ceramic strips, which are typically 25-250 microns thick. It is used to produce electronic components such as capacitors, inductors and resistors.

The LTCC process begins with the preparation of ceramic tapes. These tapes are made from a mixture of ceramic powder, organic binders, plasticizers and solvents. The mixture is formed into a thin sheet by a process known as scraping, where a blade is used to spread the mixture on a flat surface. The flakes are then dried to remove the solvent and form a flexible green tape.

The green tape is then perforated or laser cut to the desired shape and size for the production of the specific part. Conductive patterns and through-holes are created on the green tape by screen printing or photolithography. This allows for precise control of the dimensions and electrical properties of the component.

Next, the different layers of the component are stacked together and laminated under heat and pressure to form a single solid structure. This is accomplished by a thermal bonding process in which the organic adhesive breaks down and evaporates, leaving a dense ceramic structure.

Finally, the assembly is fired at a low temperature of approximately 850 degrees Celsius to sinter the ceramic and complete the densification process. This produces a robust, reliable component that can withstand harsh environments, including high temperatures and humidity.

LTCC technology has several advantages over other materials used in electronics manufacturing
Excellent high-frequency performance: LTCC materials have high dielectric constants and low losses, enabling stable signal transmission and filtering performance in the high-frequency range.

Multi-layer structure design: LTCC materials can be stacked in multiple layers to form complex three-dimensional circuit structures, resulting in higher density circuit integration, reduced overall size and improved performance.

Good reliability: LTCC materials have good mechanical strength, thermal conductivity and chemical stability, and can withstand large stresses and temperature variations, thus improving device reliability and long-term stability.

Low cost: Because LTCC materials have certain plasticity and easy processing, coupled with the simple production process, the manufacturing cost is relatively low, especially in large-scale production has obvious advantages.

Green: LTCC material is an inorganic non-metallic material that does not release harmful gases and does not produce harmful waste during the production process, which meets environmental requirements.
LTCC technology is widely used in applications where miniaturization, high frequency performance and reliability are key requirements. Some common applications include microelectromechanical systems (MEMS), wireless communication devices, and automotive electronics.